SINKER eMMC

Large capacity, high performance, and applicable to middle-range and high-end smartphones
Product Advantages
  • Universal SPI interface with internal ECC, allowing it to meet the efficiency of data transmission while ensuring data reliability
  • OTP support, providing customers with more areas to store secure information
    • Product Parameter
    产品类别* 闪存介质 容量 封装 温度 协议 接口 电压
    		尺寸
    车规级UFS 3D NAND 64GB FBGA153 -40℃~105℃ UFS 2.1 up to HS-GEAR3 2Lane VCC：3.3V ；VCCQ2：1.8V
    		11.5*13 mm
    车规级UFS 3D NAND 128GB FBGA153 -40℃~105℃ UFS 2.1 up to HS-GEAR3 2Lane VCC：3.3V ；VCCQ2：1.8V
    		11.5*13 mm
    车规级UFS 3D NAND 128GB FBGA153 -40℃~105℃ UFS 3.1 up to HS-GEAR4 2Lane VCC：2.5V ；VCCQ2：1.2V
    		11.5*13 mm
    车规级UFS 3D NAND 256GB FBGA153 -40℃~105℃ UFS 3.1 up to HS-GEAR4 2Lane VCC：2.5V ；VCCQ2：1.2V
    		11.5*13 mm
    Product Features
    • 1
      eMMC

    • 2
      EPLUS V10 microSD

    • 3
      SPI NAND Flash

    • 4
      Parallel NAND Flash

    Application

    • Industrial automation

    • PC

    • Smart TV

    • Industrial IPC

    • Dash cam

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